Laboratory etching machine with static and spray rinse, integrated developer tank, a reserve tank for e.g. chemical tinning and a squeeze dryer. The Splash-Center is suitable for double-sided PCBs. Special emphasis was put on ergonomical and clean etching and rinsing as well as on low chemical drag out.A typical workflow for example is to use tank 1 (spray compartment) for etching, tank 2 and 3 for rinsing, tank 4 (with centrifugal pump) for developing and tank 5 for tinning.
Etching Compartment:
Maintenance free etching system with solid stream nozzles
Etching speed of 35 µm Cu within 90 seconds (warm Fe-III-Cl).
Big window to the etching chamber made from transparent PVC.
Maximum board size: 210 x 300 mm /Splash-Center XL: 300 x 400
Line resolution better than 0.1 mm (100 µm)
Suitable for all common etchants. Fe-III-Cl recommended
Lid to the etching chamber with safety switch
Removable board holder made from Titanium and PVC. Can be locked in drip-off position
Easy access to the etching chamber.
Strong 1000 W Quartz heater, etching temperature controlled by thermostat
Overheat fuse
Digital timer with countdown, auto reset and beeper
Integrated rinsing zone with drip off holder.
5 ball valves for all tanks
Suitable for spray developing
Developer and rinse compartment:
Magnetic centrifugal pump to revolve developer
two integrated static rinses, one can be used for neutralization purposes
Fresh water spray zone activated by foot switch, including splash protection
A reserve tank, e.g. for immersion tin
Features:
5 ball valves to drain all tanks, cover protected from the front side.
All tanks with lids
Integrated drip tray for all tanks, sure-footed about 120 mm above the ground
Integrated mechanical squeeze dryer
Technical data:
Power supply: 220 V~, 50 Hz, approx. 1,5 kWDimensions (LxWxH): 1000 x 670 x 1200 mmWorking Level: 900 mmEtchingformat: 210 x 300 mmTank capacity: 1 x 23 L + 1 x 12 L + 3 x 8 LWeight: approx. 46 kg
