Electronics Products

ESD products are primarily used to prevent electronic circuit boards and other electronic products from the Electrostatic charge. Static control is critical during Electronic manufacturing and that is where we can help, whether you need ESD bags, ESD fingercots, ESD gloves, ESD mats, ESD tapes or ESD labels. We are here to help.

Our chemical set for galvanic through-hole-plating is characterized by sturdity and process safety.

It consists of less bathes than regular chemistry.

For our Dry film laminator RLM 419p we offer a high resolution dry film as etch resist. The rolls have a width of 304 mm and a length of either 25m or 152m. The tenting etch resist has a thickness of 38μm and is embedded between a separation and a protection foil. The resist is hardened by UV-light. The non-exposed areas are removed with an alkaline developer.

Professional protection for your PCB! We offer a high resolution dry film for solder mask application . The rolls have a width of 304 mm and a length of either 25m or 76m,and 152m . The solder mask has a thickness of 75μm and is embedded between a separation and a protection foil. The solder mask is hardened by UV-light. The non-exposed areas are removed with an alkaline developer. After developing the solder mask should be hardened or baked either with an UV-light exposer or in a special oven.

EnviroMarkTM 907 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy.

Easy Profile® 256 is a no-clean, air or nitrogen reflowable, solder paste specifically designed for maximum robustness in reflow profiling and stencil printing.

Easy Profile® 256HA is a no-clean, air or nitrogen reflowable solder paste specifically designed to provide maximum print characteristics and solderability. EP256HA has been designed for applications that require the ultimate activity with respect to difficult to solder to components and board surface metallizations.

Kester NXG1 is the preferred no-clean solder paste for lead-free applications.

Kester NXG1 is a lead-free, air and nitrogen reflowable no-clean solder paste specifically designed for the thermal requirements of lead free alloys, including the Sn96.5Ag3.0Cu0.5 alloy. The paste flux system allows joint appearances that closely resemble that achieved with SnPb alloys.

Kester 245 No-clean Cored Wire was developed to complement low residue liquid fluxes being used by the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes.

The preferred No-Clean wire solder for Lead-Free
Kester 275 No-Clean Flux for cored solder wire was developed to provide superior wetting performance for hand soldering in the electronics industry. The chemistry is based on some of the same principles that have been safely used for years in mildly activated rosin fluxes.

The preferred OA, Water-Soluble wire solder for Tin-Lead and Lead Free.
Kester 331 Organic Flux is a water soluble formula for use in flux-cored solder wire. This cored solder version of the popular 2331-ZX Neutral Organic Water Soluble Liquid Flux is more effective than rosin fluxes in soldering difficult metals.

Kester 44 Rosin Flux is an activated rosin formula for use in flux-cored solder wire. Kester 44 Rosin Flux has virtually dominated the field of activated rosin core solders for well over four decades.

The preferred activated rosin flux for Tin-Lead and Lead Free
Kester 48 Activated Rosin Flux for cored solder wire was developed for lead-free applications to enable soldering of most common metals. Kester?48 has performance characteristics far exceeding standard RA fluxes.

Kester 2235 is a high activity, organic flux designed for automated soldering of circuit board assemblies where a more aggressive flux is required, but reliability considerations are paramount. Featuring low solids, 2235 flux is ideal for soldering circuit assemblies with surface mounted components.

Kester 2331-ZX is an innovation in organic acid water-soluble flux chemistry for soldering circuit board assemblies. This unique, neutral pH chemistry flux provides the best ionic cleanliness of any organic water-soluble flux available to the electronics industry.

Kester 951 is a halogen-free, non-rosin organic flux designed for wave soldering conventional and surface mount circuit board assemblies. The extremely low solids content (2.0%) and nature of the activator system results in practically NO RESIDUE left on the assembly after soldering. Boards are dry and cosmetically clean as they exit the wave solder machine.

The Alloy Chart shows a list of the solder alloys that are available from Kester. Sn63Pb37 and Sn60Pb40 are standard alloys. Other alloys are available as special order items.

Pressure from marketing and legislation in both Europe and Asia have forced electronics manufacturers to move away from lead-based solders. Typical lead-free alloys contain 3-4% silver, which can be costly. In addition to cost concerns, typical Tin/Silver/Copper (or SAC) alloys also present issues with increased dissolution of Copper from boards and components during the soldering process. As an example, SAC305,?one of the industry’s most popular lead-free wave soldering alloys, is known to dissolve Copper at a rate more than twice as fast as Sn63Pb37.?In response to demand for a low cost and low copper dissolution alloy, Kester has developed Ultrapure®?K100LD. Kester K100LD is a eutectic Tin/Copper alloy with controlled metallic dopants to control the grain structure within the solder joint, and to minimize the dissolution of copper into the solder pot. K100LD?virtually eliminates the occurrence of common defects such as icicling and bridging. The improved grain structure also results in shinier solder joints than traditional lead-free alloy alternatives.

Lead-free wave soldering processes tend to produce a greater amount of dross than traditional leaded processes. For this reason, Kester produces all lead-free bar solder products with anti-drossing technology to improve process control and to allow the user to get the most value for the money with minimal maintenance costs. Kester Ultrapure® SAC305 Bar Solder was designed to minimize the amount of dross generated in a wave soldering, selective soldering or dip soldering process. Kester Ultrapure® SAC305 is manufactured with virgin metals which meet the high standards of Kester Ultrapure® line of Solder bar .

For soldering applications which require maximum reliability of solder joints, especially for surface mounted components, only solder of the highest purity is acceptable. Kester does not make any vague claims of outstanding solder purity. Complete analysis of Kester Ultrapure® Solder bar prove that every batch conforms to the strictest quality control standards in the solder industry.