Spray etching machine for laboratory use with integrated static rinse. Machine is suitable for double sided material. Special emphasis was put on ergonomical and clean etching and rinsing as well as on low chemical drag out.
Features:
Maintenance free system with self-cleaning nozzles and magnetic pump
Etching speed of 35 μm Cu within 90 seconds (warm Fe-III-Cl).
Big window to the etching chamber made from transparent PVC.
Maximum board size: 210 x 300 mm. (Splash XL: 300 x 400 mm)
Line resolution better than 0.1 mm (100 μm)
Suitable for all common etchants
Lid to the etching chamber with safety switch
Removable board holder made from Titanium and PVC. Can be locked in drip-off position
Easy access to the etching chamber.
Strong 1000 W Quarz heater, controlled by thermostat
Overheat fuse
Digital timer with count down, auto reset and beeper.
Integrated rinsing zone with drip off holder.
3 cog valves for all tanks
Suitable for spray developing
Technical data:
Power supply: 230 V~, 50 Hz, approx. 1,5 kWDimensions (LxWxH): 600 x 660 x 1200 mmTank capacity: approx. 23 LWeight: approx. 35 kgWorking Level: 900 mmEtching Format: 210 x 300 mm
