Spray etching machine Splash Center/Splash Center XL
Laboratory etching machine with static and spray rinse, integrated developer tank, a reserve tank for e.g. chemical tinning and a squeeze dryer. The Splash-Center is suitable for double-sided PCBs. Special emphasis was put on ergonomical and clean etching and rinsing as well as on low chemical drag out.
A typical workflow for example is to use tank 1 (spray compartment) for etching, tank 2 and 3 for rinsing, tank 4 (with centrifugal pump) for developing and tank 5 for tinning.
- 5 ball valves to drain all tanks, cover protected from the front side.
- All tanks with lids
- Integrated drip tray for all tanks, sure-footed about 120 mm above the ground
- Integrated mechanical squeeze dryer
- Power supply: 220 V~, 50 Hz, approx. 1,5 kW
- Dimensions (LxWxH): 1000 x 670 x 1200 mm
- Working Level: 900 mm
- Etching format: 210 x 300 mm
- Tank capacity: 1 x 23 L + 1 x 12 L + 3 x 8 L
- Weight: approx. 46 kg
Splash Center XL technical Details
- Power supply: 220 V~, 50 Hz, approx. 1,5 kW
- Dimensions (LxWxH): 1160 x 770 x 1200 mm
- Working Level: 900 mm
- Etching format: 300 x 400 mm
- Tank capacity: 1 x 35 L + 1 x 22 L + 3 x 15 L
- Weight: approx. 56 kg