Electronics Products

Laboratory etching machine with static and spray rinse, integrated developer tank, a reserve tank for e.g. chemical tinning and a squeeze dryer. The Splash-Center is suitable for double-sided PCBs. Special emphasis was put on ergonomical and clean etching and rinsing as well as on low chemical drag out. A typical workflow for example is to use tank 1 (spray compartment) for etching, tank 2 and 3 for rinsing, tank 4 (with centrifugal pump) for developing and tank 5 for tinning.

The Eurolux LED Precision is a vacuum exposure unit for single-sided contact exposure of photo-coated base  material, copying films etc.

Application Areas

The Bungard CCD/ATC/XL is a high quality Computer Controlled Drilling machine with Automatic Tool Change (ATC). The ATC/XL as well as all other CCDs allows directly processing of Excellon / Sieb&Meyer drill data or HP/GL route data for producing PCBs (drilling, cut-out-routing, isolation milling) or routing/ engraving plastics, aluminium and other metals. The CCD/ATC/XL differs from the CCD/MTC/XL by the automatic 25-slot tool changer. The work space is the same. Compared with the CCD/ATC the XL has a larger work space (500x600 mm in contrast to 495x325 mm with the CCD/ATC) and the number of tool slots (25 instead of 16). The ATC is ideal for very big and complex PCBs with many different drill sizes and for special applications.

Technical details

• Power supply: 110-240 V, 50-60 Hz + vacuum cleaner (1500 W)
• Range of RPM: 5.000 - 63.000
• Traveling speed: 1 – 9000 mm/min
• Resolution: 0,01 µm
• Step resolution: Software selectable: 1 mil, ½ mil, ¼ mil, 1/8mil, optional: 1/16mil + 1/32mil
• Tool diameter: 0.1 mm – 3,175 mm (recommended, bigger tool diameter possible)
• Position accuracy: 3,2µm
• Maximum position speed per axis: 9000/mm/min (=150 mm/s)
• Maximum working speed per axis: 9000/mm/min (=150 mm/s), individual setting on a per-tool basis, independent from position speed
• Drill speed: 5/s (= 18.000 holes/h = 300 holes/min)
• Required accessories: Computer
• Board fixation: span fixing, clamp fixing, reference pin system, stack processing possible
• Option: vacuum fixation

CCD/ATC/XL

• Weight: 49 kg
• Dimensions (LxWxH): 950 x 950 x 300 mm
• Work area: 500 x 600 x 38 mm
• Tool change: 25

The Bungard CCD/ATC is a high quality Computer Controlled Drilling machine with Automatic Tool Change (ATC=automatic tool change). The ATC as well as all other CCDs allows directly processing of Excellon / Sieb&Meyer drill data or HP/GL route data for producing pcbs (drilling, cutout- routing, isolation milling) or routing/engraving plastics, aluminium and other metals. The CCD/ATC differs from the CCD/MTC by the automatic 16-slot tool changer. The work space is the same. Compared with the CCD/2 the ATC has a larger work space (325x495 mm in contrast to 270x325 mm with the CCD/2) and a separate control unit. The ATC is ideal for big and more complex PCBs with many different drill sizes. 19 inch rack boards can also be processed.

Technical data:

Power supply: 110-240 V, 50-60 Hz + vacuum cleaner (1500 W) Range of RPM: 5.000 - 63.000 Traveling speed: 1 – 9000 mm/min Resolution: 0,01 µm Step resolution: Software selectable: 1 mil, ½ mil, ¼ mil, 1/8mil, optional: 1/16mil + 1/32mil Tool diameter: 0.1 mm – 3,175 mm (recommended, bigger tool diameter possible) Position accuracy: 3,2µm Maximum position speed per axis: 9000/mm/min (=150 mm/s) Maximum working speed per axis: 9000/mm/min (=150 mm/s), individual setting on a per-tool basis, independent from position speed Drill speed: 5/s (= 18.000 holes/h = 300 holes/min) Required accessories: Computer Board fixation: span fixing, clamp fixing, reference pin system, stack processing possible Option: vacuum fixation

CCD/ATC

Weight: 35 kg Dimensions (LxWxH): 700 x 800 x 300 mm Work area: 325 x 495 x 38 mm Tool change: 16

The Bungard CCD/MTC is a high quality computer controlled drilling and milling machine with semi-automatic tool change (MTC = manual tool change). The CCD/MTC differs from the CCD/2 by a larger working area (325x495 mm in contrast to 270x325 mm) and by a separate controller. Compared to the ATC models, the software interrupts the operation during the tool change and the new tool is changed manually (turning the knob changes by a quarter turn; motors remain empowered and hold the position). With the sturdy spindle and the good fixation of the tool in the chuck the Bungard CCD / MTC is perfectly fitted for routing or engraving plastics, aluminum and other metals. 19 inch rack boards can also be processed.

Technical Details:

• Power supply: 110-240 V, 50-60 Hz + vacuum cleaner (1500 W)
• Range of RPM: 5.000 - 63.000
• Traveling speed: 1 – 9000 mm/min
• Resolution: 0,01 µm
• Step resolution: Software selectable: 1 mil, ½ mil, ¼ mil, 1/8mil, optional: 1/16mil + 1/32mil
• Tool diameter: 0.1 mm – 3,175 mm (recommended, bigger tool diameter possible)
• Position accuracy: 3,2µm
• Maximum position speed per axis: 9000/mm/min (=150 mm/s)
• Maximum working speed per axis: 9000/mm/min (=150 mm/s), individual setting on a per-tool basis, independent from position speed
• Drill speed: 5/s (= 18.000 holes/h = 300 holes/min)
• Required accessories: Computer
• Board fixation: span fixing, clamp fixing, reference pin system, stack processing possible
• Option: vacuum fixation CCD/MTC
• Weight: 35 kg
• Dimensions (LxWxH): 700 x 800 x 300 mm
• Work area: 325 x 495 x 38 mm
• Tool change: no

This machine from the COMPACTA-series was consequently designed to meet the demands of professional direct metallization. It can take boards up to 210 x 300 mm² and has 5 treatment tanks (cleaning - pre-dip - catalyst - intensifier - reserve tank) and one galvanic plating tank. Two treatment tanks are thermostatically controlled and equipped with a Teflon heater. Bath movement on all tanks is performed with DCgear motor. The stroke speed is stepless variable. The galvanic plating tank comes with an integrated air injection and a stepless regulated rectifier. A Volt- and an Amperemeter show the current electric values. Special emphasis was put on a unique rinsing technique. A double cascade rinse and a spray rinse, the latter activated via foot switch and a magnetic valve, are integral parts of the COMPACTA 30. We also offer the COMPACTA as a complete system including chemicals, anodes, anode holders and board holders.

Treatment tanks:

Dimensions (LxWxD): 400 x 100 x 300 mm Capacity: approx. 10 l Galvanic copper tanks: Dimensions (LxWxD): 400 x 275 x 300 mm Capacity: approx. 30 l

Accessories/Options:

• Digital timers for each bath (included in delivery!).

• Required accessories (not included in delivery!): Chemicals, anodes, anodes holder and board holder.

Technical data:

Dimensions (LxWxH): 880 x 1000 x 1350 mm Working level: 950 mm Weight: approx. 80 kg Heaters: 2 x 400 W Rectifier: 1 x 6 V, 40 A Bath movement: DC-gear motor Power supply: 220 V, 50 Hz, 6.3 A

Based on the same principle of construction as our Compacta 30 series, the Compacta 40 2CU is optimized for higher productivity. You can manufacture boards with a maximum size of 300 x 400 mm2 . This enlargement plus an integral, second plating bath leads to almost 4 times higher daily throughput with only little more space requirements. Based on the COMPACTA-series we also produce machines for other chemical systems. Alternatives for improved surface qualities: Bungard is also experienced in galvanic nickelgold-systems for long lasting, bondable surface quality. Moreover tin-, blackening- or sealbond-systems are available. Contact us for your individual, customized solution.

Treatment tanks:

Dimensions (LxWxD): 500 x 100 x 450 mm Capacity: approx. 20 l Galvanic tanks: Dimensions (LxWxD): 500 x 300 x 450 mm Capacity: ca. 60 l

Accessories/Options:

• Digital timers for each bath (included in delivery!)
• Required accessories (not included in delivery!): Chemicals, anodes, anodes holder and board holder

Technical data:

Dimensions (LxWxH): 1200 x 1180 x 1390 mm Working level: 950 mm Weight: approx. 130 kg Heaters: 2 x 800 W Rectifier: 2 x 6 V, 80 A Bath agitation: DC gear motor Power supply: 220 V, 50 Hz, 6.3 A

  This results in an extremely robust compact construction. The high-precision etching result is achieved by the uniform volume fl ow of the nozzle spray bar in conjunction with the rotating clamping wheel and the uniform liquid fl ow of the etching medium. The special nozzles are internally designed in such a way that the full spray cone strikes the rotating etch material with a twist. During the etching process, the clamping wheel is constantly rotated via a geared motor and transport rollers. The titanium heating is controlled by a digital thermostat. The etchant pump is controlled by a digital timer with automatic reset and fi nal acoustic signal. Setting range 0-599 seconds.

The DL 500 is a double sided conveyorized spray etching machine with integrated rinsing zone. This machine is easy to maintain and fits perfectly to a modern PCB laboratory. The maximum capacity within one hour is 10 m². Designed for being used for laboratory purposes, there are lots of different applications (e.g. spray developing of tenting or solder mask) and options available. Of course the machine can be modified according to your needs.

Features:

Working width 510 mm

• Adjustable conveyor speed 0 - 1.5 m/min.

• Joint free belt drive

• PCB is firmly secured by upper and lower transport rollers

• Powerful etchant pump (200 l/min)

• Double sided etching with 4 x 14 flat jet nozzles. Due to special nozzle pattern, there are 6 rows of nozzles for each side !

• Adjustable spray pressure. Upper and lower spray pressure can be regulated separately

• Thermostat with digital read out and selfsafe overheat cut-off

• Integrated rinse zone. Optional fresh water rinse with solenoid valve or recycle watertank

• Drying by squeezing rollers with tissue Sturdy stand alone construction from PVC and Titanium

• Transparent top with security switch

• Line definition down to 35 µm lines and spaces on 18 µm copper

• 1000 W quartz heater

• Maintenance free design, just normal cleaning/refilling

• Easy disassembly and full access to all inner parts without special tools

• Suitable for all regular etching agents. We recommend to use ferric-chloride. Please pay attention to the special features of each etchant (crystallization of persulfates and ammonium, exothermic reactions while etching). For alkaline etching, machine must be modified.

 

Technical data:

• Power supply: 230 V~, 50 Hz, approx. 1.5 kW
• Dimensions: (LxWxH): 1200 x 670 x 1290 mm
• Weight: approx. 100 kg
• Etchingformat: 510 mm x endless
• Working Level: approx. 55 l

Variants:

• Variant # 1 Spray Developing Machine

The DL 500 can be used as a spray developing machine for negative and positive etch resist or solder mask without modifications. Simply change the media!

• Variant # 2 Spray Etching Machine

standard variant

• Variant # 3 Spray Stripping Machine

This machine is equipped with an additional filter basket at the front side of the machine to remove residues of tenting or solder mask from the stripping liquid (see picture on the right).

Options:

Option # 1: Closed-loop Rinsing Tank

Recycled rinsing tank with magnetic centrifugal pump instead of fresh water. Saves water costs. With a cock drain valve the used rinsing water can be used to compensate evaporation losses or to make up new etching liquid. Waste water free rinsing technique. The magnetic valve from the standard version is here obsolete. The tank fits underneath the machine body of DL 500. Format: 200x600x700 mm (BxHxT).

Option # 2: Conveyorised Rinsing Unit

a.) conveyorised rinsing unit, stand alone version with adjustable conveyor speed, integrated magnetic valve for fresh water inlet (controlled by DL 500), squeeze drying roller. Transport width and height same as DL 500. Format: 450 x 940 x 620 mm (BxHxT). b.) as above but second stage cascade rinse (in combination with recycled rinse tank and magnetic centrifugal pump), 3 way cock valve to bypass rinsing water e.g. to water treatment unit IONEX. Format: 450 x 940 x 620 mm (BxHxT).

Option # 3: Inspection Table

Control zone in form of a roller table (not conveyorised). This roller table can be mounted between two DL 500 (e.g. Developer and Etcher), between DL 500 and rinsing unit or as a single exit table. Format ca. 620x530x50 mm (BxHxT).

Option # 4: Production Line

3 DL 500 and the rinsing unit can be connected to a small production line (Developing – Etching – Stripping - Cleaning) coupled together with inspection tables. Of course other variants are possible as well.

Option # 5: DL 500 S

This machine is equipped with an additional filter basket at the front side of the machine to remove residues of tenting or solder mask from the stripping liquid.

Option # 6: DL 500 Vario

DL 500 Vario with separate adjustable spray pressure for the upper and lower side. For physical reasons the etching result from the upper side is different from the lower side. Adjusting the spray pressure for one side may compensate this phenomena. In contrast to etching machines from competitors the PCB in the DL 500 is firmly fixed throughout the whole process by upper and lower transport rollers. This makes it possible to switch off completely the upper nozzles without lifting the PCB by the spray pressure of the lower nozzles.

Option # 7: Cooler

Some etching agents as well as other chemicals tend to exothermic reactions and need to be cooled during the treatment process. For this purpose we offer a special cooler for the DL 500. The Cooler consists of a recycling rinsing tank with cooling coils for the etching liquid. With a cock valve the etching agent is adjustable bypassed through the cooler.

Option # 8: DL 500 triple phases power supply

You can order the DL 500 either with a single phases or triple phases power supply.

Option # 9: Filter unit

On request you can equipp your DL 500 with one or two 10 " filter units to remove residues from the etching process. You can easily adjust the filter throughput via cock valve. On the picture you can see a filter unit together with an exit table.

Option # 10: Exit Table